103A0-C200-00

3M Electronic Solutions Division
517-103A0-C200-00
103A0-C200-00

Mfr.:

Description:
D-Sub Backshells 100P JUNCTION SHELL STRT EXIT W/O KEY Zn

Datasheet:
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Learn more about 3M Electronic Solutions Division 103A0-C200-00

In Stock: 149

Stock:
149
Can Dispatch Immediately
On Order:
200
Factory Lead Time:
19
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
13,87 € 13,87 €
12,56 € 125,60 €
12,22 € 244,40 €

Product Attribute Attribute Value Select Attribute
3M
Product Category: D-Sub Backshells
EMI/RFI Shielded Backshell
Straight
1 Entry
Zinc
Nickel
100 Position
Each
Brand: 3M Electronic Solutions Division
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: JP
Product Type: D-Sub Backshells
Factory Pack Quantity: 100
Subcategory: D-Sub Connectors
Part # Aliases: 54862335585 7100003986 JE150407532
Unit Weight: 30 g
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Attributes selected: 0

Datasheet

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TARIC:
8538909999
CNHTS:
8538900000
CAHTS:
8538909090
USHTS:
8538908180
JPHTS:
853890000
BRHTS:
85389090
ECCN:
EAR99

MDR Accessories

3M offers a range of EMI/RFI  D-Sub Backshells in a variety of materials to accommodate pin counts from 14 to 100, thru-hole, surface mount and press fit mounting styles, IDC and solder termination versions, and multiple connector orientations.

High-Density I/O Connectors & Assemblies

3M High-Density I/O Connectors and Assemblies are based on the long-established Delta Ribbon Centronics®-style Mini Delta Ribbon (MDR) System. The Mini Delta Ribbon (MDR) Connectors are a half-pitch interconnect system designed to meet the needs of high-speed/density I/O applications. The MDR system offers a proven solution that provides shielding against EMI/ESD and reliable connection through the pre-loaded ribbon contacts, as well as 0.050" centerlines. The MDR connectors and assemblies allow mass termination through IDC U-shaped contacts and offer a wide range of pin counts and form factors to enable design flexibility.

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