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ATS031031023-SF-10V

Name: Advanced Thermal Solutions ATS031031023-SF-10V
Brand: Advanced Thermal Solutions
SKU: 984-AT031031023SF10V
Price: 7.88 EUR
Availability: InStock

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Mouser No:

984-AT031031023SF10V

Mfr. No:

ATS031031023-SF-10V

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks BGA Heat Sink, High Aspect Ratio Extrusion, Straight, No TIM, 31x31x23mm

Datasheet:

ATS031031023-SF-10V Datasheet (PDF)

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	7,88 €	7,88 €
	7,55 €	75,50 €
	7,13 €	142,60 €
	6,71 €	335,50 €
	6,29 €	629,00 €
	5,87 €	1.174,00 €
	5,63 €	2.815,00 €
	5,44 €	5.440,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sinks
Designed for:	BGA
Mounting Style:	PCB
Heatsink Material:	Aluminum
Fin Style:	Straight Fin
Thermal Resistance:	3.31 C/W
Length:	31 mm
Width:	31 mm
Height:	23 mm
Brand:	Advanced Thermal Solutions
Color:	Black
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	BGA High Aspect Ratio
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	Value-Line Platform
Type:	Component

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Datasheet

ATS031031023-SF-10V Datasheet (PDF)

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USHTS:: 7616995100
ECCN:: EAR99

Straight Fin Value-Line Heat Sinks

Advanced Thermal Solutions Straight Fin Value-Line Heat Sinks are high-performance heat sinks with high aspect ratios and are ideal for compact PCB environments. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm with height ranges from 2mm to 25mm with 1mm increments. The straight fin value-line heat sinks can be attached to the devices with double-sided thermal adhesives, Z-clip, or maxiGRIP™ technologies. The higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks. The straight fin design offers an excellent cooling solution for spatially constrained PCB layouts. These straight-fin heat sinks can be applied to various components, including Altera^®, AMD, Freescale, Intel^®, TI, and Xilinx.

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.