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2191131

Name: Bergquist Company 2191131
Brand: Bergquist Company
SKU: 951-2191131
Price: 0.61 EUR
Availability: OutOfStock

Mouser No:

951-2191131

Mfr. No:

2191131

Mfr.:

Bergquist Company

Description:

Thermal Interface Products GAP PAD, Highly Conformable, Conductive for Filling Air Gaps

This product will be sent to you directly from the manufacturer. You may order this product now. Mouser will notify you of the estimated dispatch date.

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

2191131 Datasheet (PDF)

ECAD Model:

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Availability

Stock:: 0

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Factory Lead Time:: 6 Weeks Estimated factory production time.

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Minimum: 2300 Multiples: 1

Unit Price:

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Est. Tariff:

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	0,611 €	1.405,30 €
	0,561 €	1.402,50 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Bergquist Company
Product Category:	Thermal Interface Products
RoHS:
Series:	VO Soft / TGP 800VOS
Brand:	Bergquist Company
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	US
Product Type:	Thermal Interface Products
Factory Pack Quantity:	1
Subcategory:	Thermal Management
Tradename:	GAP PAD
Part # Aliases:	GPVOS-0.040-AC-54
Unit Weight:	529 mg

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Datasheet

2191131 Datasheet (PDF)

GAP PAD® Thermally Conductive Materials

Bergquist GAP PAD® Thermally Conductive Materials meet the electronic industry’s growing need for interface materials with greater conformability, higher thermal performance, and easier application. The extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps, and rough surface textures are present. The GAP PAD Thermally Conductive Materials are available in a variety of thicknesses and hardnesses, a range of thermal conductivity ratings, in sheets or die-cut parts, and with fiberglass/rubber carrier or non-reinforced versions. GAP PAD products are well suited to a wide variety of electronic, automotive, medical, and aerospace/defense applications.