2605474

Bergquist Company
951-2605474
2605474

Mfr.:

Description:
Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K

Datasheet:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
4 Weeks Estimated factory production time.
Minimum: 80   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
8,22 € 657,60 €
7,93 € 793,00 €
7,55 € 1.887,50 €
7,28 € 3.640,00 €
7,03 € 7.030,00 €

Product Attribute Attribute Value Select Attribute
Bergquist Company
Product Category: Thermal Interface Products
RoHS:  
TLF 6000HG
Brand: Bergquist Company
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Product Type: Thermal Interface Products
Factory Pack Quantity: 1
Subcategory: Thermal Management
Tradename: Liqui-Form
Part # Aliases: P485129
Unit Weight: 1 kg
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Attributes selected: 0

Datasheet

Data Centre Applications

Bergquist Company Data Center Applications feature advanced materials that help with thermal management, long-term reliability, and stress protection. Data center speeds and volumes are growing as analytics, artificial intelligence (AI), and high-performance computing go mainstream. This increased demand is causing next-generation data centers to run hotter, and this heat can degrade performance. Bergquist Company designs and manufactures component-level thermal management and stress protection products, which help meet these heightened performance requirements.

Router Switch & Network Applications

Bergquist Company Router Switch and Network Applications include phase change materials and thermally conductive adhesives designed to dissipate heat away from thermally sensitive components. The utilization of advanced materials in server motherboards and line cards for routers and switches offers benefits such as scale and cost reduction. One small uptick in performance, repeated thousands of times, provides a notable impact on router and switch performance. Thermal products from Bergquist Company help components function properly for optimal operation.

Storage Applications

Bergquist Company Storage Applications feature advanced materials used in storage hardware to provide increased reliability, greater stability, and improved transfer rates. Every uptick in reliability and performance lowers costs while meeting increased user expectations. The thermal management materials from Bergquist Company include a broad variety of product types to meet various application needs.

Server Applications

Bergquist Company Server Applications feature thermal management products designed for a wide range of use — from a few servers in a closet to thousands of them in a data center. No matter the number of servers, a slight reduction in heat or improvement in component performance can significantly impact infrastructure operation. Bergquist Company offers advanced materials for use throughout a circuit board, helping to optimize performance and the corresponding network.

Liqui-Form TLF 6000HG 6W/m-K Liquid Formable Gel

Bergquist Company Liqui-Form TLF 6000HG 6W/m-K  Liquid Formable Gel is designed to meet the performance needs of next-generation 5G base stations and remote antenna systems. The pre-cured, one-part gel has a thermal conductivity of 6.0W/m-K and can be used in gaps as large as 3mm. The gel offers high thermal conductivity, good dispensing efficiency, and high thermal reliability. This material is specially designed to provide an effective electronic component cooling capability for 5G base stations and remote antenna assemblies where a highly reliable vertical gap stability is required. Bergquist Liqui-Form TLF 6000HG Liquid Formable Gel is pre-cured, requiring no mixing or refrigeration.

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