GPVOS-0.060-AC-0816

Bergquist Company
951-GPVOS-0060-AC
GPVOS-0.060-AC-0816

Mfr.:

Description:
Thermal Interface Products GAP PAD, 8"x16" Sheet, 0.060" Thickness, 1 Side Adhesive, TGP800VOS/VO Soft
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Availability

Stock:
0

You can still purchase this product for backorder.

Factory Lead Time:
5 Weeks Estimated factory production time.
Minimum: 15   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
52,27 € 784,05 €
48,89 € 1.222,25 €
47,12 € 2.356,00 €
45,41 € 4.541,00 €

Product Attribute Attribute Value Select Attribute
Bergquist Company
Product Category: Thermal Interface Products
RoHS:  
Gap Fillers / Gap Pads / Sheets
Thermal Pad
Non-standard
Silicone
0.8 W/m-K
6 kVAC
Gold/Pink
- 60 C
+ 200 C
406.4 mm
203.2 mm
1.524 mm
40 psi
UL 94 V-0
VO Soft / TGP 800VOS
Brand: Bergquist Company
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Designed for: Telecommunications, Computers and Peripherals, Power Conversion
Product Type: Thermal Interface Products
Size: 8 in x 16 in
Factory Pack Quantity: 1
Subcategory: Thermal Management
Tradename: GAP PAD
Part # Aliases: L8INW16INH0.06 BG402630 L8INW16INH0D0 2165901
Unit Weight: 246,754 g
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Attributes selected: 0

CNHTS:
3824999999
USHTS:
3919905060
KRHTS:
3919900000
MXHTS:
3919909900
ECCN:
EAR99

GAP PAD® Thermally Conductive Materials

Bergquist GAP PAD® Thermally Conductive Materials meet the electronic industry’s growing need for interface materials with greater conformability, higher thermal performance, and easier application. The extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps, and rough surface textures are present. The GAP PAD Thermally Conductive Materials are available in a variety of thicknesses and hardnesses, a range of thermal conductivity ratings, in sheets or die-cut parts, and with fiberglass/rubber carrier or non-reinforced versions. GAP PAD products are well suited to a wide variety of electronic, automotive, medical, and aerospace/defense applications.

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