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Mfr.	Mfr. No:	Qty	Ext Total

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TS991SNL35T4

Chip Quik

Images are for reference only
See Product Specifications

Mouser No:

910-TS991SNL35T4

Mfr. No:

TS991SNL35T4

Mfr.:

Chip Quik

Description:

Solder Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T4 (35g syringe)

Datasheet:

TS991SNL35T4 Datasheet (PDF)

In Stock: 8

Stock:: 8 Can Dispatch Immediately

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Factory Lead Time:: 6 Weeks Estimated factory production time for quantities greater than shown.

Enter Quantity:

Minimum: 1 Multiples: 1

Unit Price:

-,-- €

Ext. Price:

-,-- €

Est. Tariff:

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	38,64 €	38,64 €
	35,42 €	177,10 €
	30,59 €	305,90 €
	27,37 €	684,25 €
	25,11 €	1.255,50 €
	23,55 €	2.355,00 €
	23,54 €	5.885,00 €
	23,53 €	11.765,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Chip Quik
Product Category:	Solder
RoHS:
Product:	Solder Paste
Type:	Lead Free, No Clean Synthetic Flux Core
Alloy:	Sn96.5/Ag03/Cu0.5
Package Type:	Syringe
Size:	10 cc
Brand:	Chip Quik
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CA
Product Type:	Solder
Factory Pack Quantity:	1
Subcategory:	Solder & Equipment

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Filter Document:

Datasheet

TS991SNL35T4 Datasheet (PDF)

MSDS

Test/Quality Data

Safety Data Sheet (PDF)

CNHTS:: 3810100000
CAHTS:: 3810100000
USHTS:: 3810100000
JPHTS:: 381010000
MXHTS:: 3810100100
ECCN:: EAR99

FEATURED PRODUCTS

CHIP QUIK

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High-purity gold >99.99% is designed specifically for wire bonding.

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Sn95.5/Ag4.0/Cu0.5 Solder Spheres for BGAs

Manufactured from virgin materials to meet or exceed the requirements of a building.

Indium Solder Ribbon (In52/Sn48)

Features 11.9N/mm² (at 20°C) tensile strength and 118°C (244°F) melting point.