14L-602-210-AA2

EDAC
587-14L-602-210-AA2
14L-602-210-AA2

Mfr.:

Description:
Headers & Wire Housings 14L Series (.156"(3.96mm) contact spacing) Inline 2 positions socket housing only

Datasheet:
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Learn more about EDAC 14L-602-210-AA2

In Stock: 924

Stock:
924 Can Dispatch Immediately
Factory Lead Time:
16 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
0,172 € 0,17 €
0,142 € 1,42 €
0,118 € 2,95 €
0,105 € 10,50 €
0,09 € 22,50 €
0,076 € 76,00 €
0,069 € 207,00 €
0,065 € 325,00 €
0,063 € 630,00 €

Product Attribute Attribute Value Select Attribute
EDAC
Product Category: Headers & Wire Housings
RoHS:  
Wire Housings
Socket
2 Position
3.96 mm (0.156 in)
1 Row
Cable Mount / Free Hanging
Crimp
Straight
Gold
14L
Wire-to-Board
22 AWG to 18 AWG
- 25 C
+ 105 C
Bulk
Brand: EDAC
Contact Material: Phosphor Bronze
Contact Type: Socket
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Current Rating: 7 A
Flammability Rating: UL 94 V-0
Housing Colour: Natural
Housing Gender: Female
Housing Material: Nylon
Insulation Resistance: 1 GOhms
Product Type: Headers & Wire Housings
Factory Pack Quantity: 1000
Subcategory: Headers & Wire Housings
Voltage Rating: 250 VAC/DC
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Attributes selected: 0

Datasheet

Test/Quality Data

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TARIC:
8536693000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
BRHTS:
85366990
ECCN:
EAR99

14L Series 3.96mm Inline Wire-to-Board Connectors

EDAC 14L Series 3.96mm Inline Wire-to-Board Connectors feature a 3.96mm pitch, 7A current rating, and an operating temperature range of -25°C to +105°C. The insulator material has a UL 94V-0 flammability rating and top- or side-entry configurations. 14L series connectors accept 22AWG to 18AWG wires and offer a 1500VAC dielectric withstanding voltage, 1000MΩ insulation resistance, and 10mΩ maximum contact resistance. EDAC 14L Series 3.96mm Inline Wire-to-Board Connectors are for use with PCB boards of 1.6mm nominal thicknesses.

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.

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