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1008AS-R56J-01

Name: Fastron 1008AS-R56J-01
Brand: Fastron
SKU: 434-1008AS-R56J-01
Price: 0.11 EUR
Availability: OutOfStock

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Mouser No:

434-1008AS-R56J-01

Mfr. No:

1008AS-R56J-01

Mfr.:

Fastron

Description:

RF Inductors - SMD 560nH 25Mhz 5% Tol

Datasheet:

1008AS-R56J-01 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Fastron 1008AS-R56J-01

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 9 Weeks Estimated factory production time.

Enter Quantity:

Minimum: 2000 Multiples: 2000

Unit Price:

-,-- €

Ext. Price:

-,-- €

Est. Tariff:

This Product Ships FREE

Pricing (EUR)

Qty.	Unit Price	Ext. Price
Full Reel (Order in multiples of 2000)
	0,115 €	230,00 €
	0,105 €	420,00 €
	0,10 €	1.000,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Fastron
Product Category:	RF Inductors - SMD
RoHS:
Product:	RF Inductors
Type:	Wirewound
Qualification:	AEC-Q200
Packaging:	Reel
Application:	RF
Brand:	Fastron
Core Material:	Ceramic
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	MY
Inductance:	560 nH
Maximum DC Resistance:	4.3 Ohms
Mounting Style:	PCB Mount
Product Type:	RF Inductors - Leaded
Series:	1008AS
Shielding:	Unshielded
Factory Pack Quantity:	2000
Subcategory:	Inductors, Chokes & Coils
Termination:	Standard
Termination Style:	SMD/SMT

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Datasheet

1008AS-R56J-01 Datasheet (PDF)

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TARIC:: 8504509590
CNHTS:: 8504500000
CAHTS:: 8504500000
USHTS:: 8504508000
JPHTS:: 8504500001
KRHTS:: 8504509090
MXHTS:: 8504509102
BRHTS:: 85045000
ECCN:: EAR99

RF Chip Inductors

Fastron RF Chip Inductors feature a ceramic core and are designed for RF applications that require optimal Q on high-frequency circuits. Fastron RF chip inductors feature gold flash pad metallization to provide better solderability for a higher yield in production, and the encapsulation not only protects the winding but also allows surface mount assembly. Case sizes are available in 0402, 0603, 0805, 1008, 1206, and 1210 with an operating temperature range from -40°C to +125°C. Applications include mobile telecommunication, automotive subsystems, and wireless communication.