CYBT-333032-02

Infineon Technologies
727-CYBT-333032-02
CYBT-333032-02

Mfr.:

Description:
Bluetooth Modules - 802.15.1 BT DM INDUSTRIAL AND IOT

ECAD Model:
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In Stock: 383

Stock:
383 Can Dispatch Immediately
Factory Lead Time:
29 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
7,60 € 7,60 €
6,59 € 65,90 €
6,24 € 156,00 €
5,76 € 576,00 €
5,47 € 1.367,50 €
Full Reel (Order in multiples of 500)
5,06 € 2.530,00 €
4,79 € 4.790,00 €
4,74 € 11.850,00 €
5.000 Quote

Product Attribute Attribute Value Select Attribute
Infineon
Product Category: Bluetooth Modules - 802.15.1
RoHS:  
BLE, Bluetooth 5.0
I2C, I2S, PCM, SPI, UART
9 dBm
4 Mb/s
- 96.5 dBm
2.44 GHz
2.3 V
3.6 V
- 30 C
+ 85 C
Reel
Cut Tape
Antenna: External
Antenna Connector Type: RF Solder Pad
Brand: Infineon Technologies
Core: ARM Cortex M3
Country of Assembly: CN
Country of Diffusion: SG
Country of Origin: CN
Dimensions: 12 mm x 13.5 mm x 1.95 mm
Frequency Range: 2.402 GHz to 2.48 GHz
Height: 1.95 mm
Length: 13.5 mm
Memory Size: 512 kB, 352 kB
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Operating Supply Voltage: 2.3 V to 3.6 V
Product Type: Bluetooth Modules
Protocol - Bluetooth, BLE - 802.15.1: Bluetooth LE, Classic Bluetooth
Sensitivity: - 96.5 dBm
Factory Pack Quantity: 500
Subcategory: Wireless & RF Modules
Supply Current Receiving: 26.4 mA
Supply Current Transmitting: 52.5 mA
Width: 12 mm
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TARIC:
8517620000
USHTS:
8517620090
JPHTS:
851762090
ECCN:
5A992.C

AIROC™ BLUETOOTH® & BLUETOOTH LE Modules

Infineon Technologies AIROC™ BLUETOOTH® and BLUETOOTH LE Modules assist users in developing Internet of Things (IoT) design quickly and efficiently. These modules greatly reduce development risk and accelerate time to market. Additionally, the modules are qualified by Bluetooth SIG and have received regulatory certification approval from organizations like FCC, ISED, MIC, and CE. This allows users to focus on creating unique IoT applications without worrying about the complexities of board bring-up, RF/spec testing, performance testing, and regulatory testing.