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F46MR20W3M1HB11BPSA1

Name: Infineon F46MR20W3M1HB11BPSA1
Brand: Infineon Technologies
SKU: 726-F46MR20W3M1HB11B
Price: 489.39 EUR
Availability: InStock

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Mouser No:

726-F46MR20W3M1HB11B

Mfr. No:

F46MR20W3M1HB11BPSA1

Mfr.:

Infineon Technologies

Description:

MOSFET Modules EasyPACK module with CoolSiC Trench MOSFET and PressFIT / NTC

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

F46MR20W3M1HB11BPSA1 Datasheet (PDF)

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In Stock: 3

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Factory Lead Time:: 10 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	489,39 €	489,39 €
	423,22 €	3.385,76 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	MOSFET Modules
RoHS:
Technology:	SiC
Mounting Style:	Press Fit
Transistor Polarity:	N-Channel
Number of Channels:	1 Channel
Vds - Drain-Source Breakdown Voltage:	1.2 kV
Id - Continuous Drain Current:	470 A
Rds On - Drain-Source Resistance:	1.91 Ohms
Vgs - Gate-Source Voltage:	- 7 V, + 20 V
Vgs th - Gate-Source Threshold Voltage:	5.15 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 175 C
Pd - Power Dissipation:	20 mW
Series:	EasyPACK
Packaging:	Tray
Brand:	Infineon Technologies
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	AT
Fall Time:	74 ns
Product:	Modules
Product Type:	MOSFET Modules
Rise Time:	261 ns
Factory Pack Quantity:	8
Subcategory:	Discrete and Power Modules
Typical Turn-Off Delay Time:	276 ns
Typical Turn-On Delay Time:	156 ns
Part # Aliases:	F4-6MR20W3M1H_B11 SP005975717

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Datasheet

F46MR20W3M1HB11BPSA1 Datasheet (PDF)

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TARIC:: 8541210000
CAHTS:: 8541210000
USHTS:: 8541210095
JPHTS:: 854121000
MXHTS:: 8541210100
ECCN:: EAR99

EasyPACK™ CoolSiC™ Trench MOSFET Modules

Infineon Technologies EasyPACK™ CoolSiC™ Trench MOSFET Modules feature PressFIT contact technology and an integrated Negative Temperature Coefficient (NTC) temperature sensor. These modules operate at a 1200V drain-source voltage, feature a low inductive design, low switching losses, and high current density. The EasyPACK™ modules offer rugged mounting due to integrated mounting clamps and are packaged with a CTI >600. Applications include high-frequency switching devices, DC/DC converters, and DC chargers for EVs. With the Easy 2C Series, Infineon enhances high-power designs using SiC G2 technology and advanced .XT features. The .XT technology provides enhanced ruggedness and extended operating temperatures, while the second-generation SiC MOSFET technology offers improved gate oxide reliability and reduced on-resistance.