FF600R12ME4B72BOSA1
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See Product Specifications
See Product Specifications
726-FF600R12ME4B72BO
FF600R12ME4B72BOSA1
Mfr.:
Description:
IGBT Modules MEDIUM POWER ECONO
IGBT Modules MEDIUM POWER ECONO
Datasheet:
In Stock: 22
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Stock:
-
22Can Dispatch ImmediatelyAn unexpected error occurred. Please try again later.
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On Order:
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20
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Factory Lead Time:
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22Weeks Estimated factory production time for quantities greater than shown.
This Product Ships FREE
Pricing (EUR)
| Qty. | Unit Price |
Ext. Price
|
|---|---|---|
| 152,20 € | 152,20 € | |
| 152,19 € | 1.521,90 € |
Datasheet
Application Notes
- Application Note IGBT Definition of Junction Temperature (PDF)
- Driving IGBTs with unipolar gate voltage (PDF)
- Evaluation Board for 2ED300C17 -S/ -ST (AN2007-05) (PDF)
- Evaluation Driver Board for EconoDUAL ME3, ME4 and EconoPACK+ modules (PDF)
- Industrial IGBT Modules Explanation of Technical Information (PDF)
- Module Adapter Board for EconoDUAL™3 IGBT Modules (PDF)
- Mounting instructions EconoDUAL™ 3 Modules (PDF)
- Transient Thermal Measurements and thermal equivalent circuit models (PDF)
- Using the NTC inside a power module (PDF)
Product Catalogs
- EconoDUAL™, EconoPACK™ 4 and EconoPACK™ + Power Modules (PDF)
- Infineon's Latest Power and Sensing Guide (PDF)
- PressFIT - Our established, reliable mounting technology (PDF)
- Solutions for Industrial Drives (PDF)
- Solutions for Traction Systems (PDF)
- Solutions for Uninterruptible Power Supply (UPS) Systems (PDF)
Technical Resources
- „Econo“ my improvement in inverter-converter-moduldesign (PDF)
- Comparison between active and passive thermal cycling stress with respect to substrate solder reliability in IGBT modules with Cu baseplates (PDF)
- Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules (PDF)
- Gehirn trifft Muskel: FPGA steuert Leistungshalbleiter an - Article in Elektronikpraxis 05.2014 (PDF)
- IGBT Module technology state of the art and future evolutions (PDF)
- Improving Efficiency in AC drives: Comparison of Topologies and Device Technologies (PDF)
- New superior assembly technologies for modules with highest power densities (PDF)
- PressFIT Technology, a Solderless Method for Mounting Power Modules (PDF)
- Reliability of PressFIT connections (PDF)
- Saving money: SiC in UPS applications (PDF)
- The challenge of accurately analyzing thermal resistances (PDF)
Test/Quality Data
- TARIC:
- 8541290000
- USHTS:
- 8541290065
- ECCN:
- EAR99
