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FS770R08A6P2BBPSA1

Name: Infineon FS770R08A6P2BBPSA1
Brand: Infineon Technologies
SKU: 726-FS770R08A6P2BBPS
Price: 341.98 EUR
Availability: OutOfStock

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Mouser No:

726-FS770R08A6P2BBPS

Mfr. No:

FS770R08A6P2BBPSA1

Mfr.:

Infineon Technologies

Description:

IGBT Modules HYBRID PACK DRIVE G1 SI

Datasheet:

FS770R08A6P2BBPSA1 Datasheet (PDF)

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Availability

Stock:: Non-Stocked

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Factory Lead Time:: 26 Weeks Estimated factory production time.

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	341,98 €	4.103,76 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	IGBT Modules
RoHS:
Product:	Hybrid IGBT Modules
Configuration:	6-Pack
Collector- Emitter Voltage VCEO Max:	750 V
Collector-Emitter Saturation Voltage:	1.1 V
Continuous Collector Current at 25 C:	450 A
Gate-Emitter Leakage Current:	400 nA
Pd - Power Dissipation:	654 W
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 125 C
Packaging:	Tray
Brand:	Infineon Technologies
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	DE
Maximum Gate Emitter Voltage:	20 V
Mounting Style:	SMD/SMT
Product Type:	IGBT Modules
Series:	IGBT EDT2
Factory Pack Quantity:	6
Subcategory:	IGBTs
Technology:	Si
Tradename:	HybridPACK PressFIT
Part # Aliases:	FS770R08A6P2B SP001706976
Unit Weight:	605 g

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TARIC:: 8541290000
CNHTS:: 8504409100
USHTS:: 8541290065
ECCN:: EAR99

Automotive HybridPACK™ IGBT Modules

Infineon Technologies Automotive HybridPACK™ IGBT Modules extend across the full power spectrum required in electric and hybrid electric vehicles (EVs/HEVs). These compact modules are available in six RoHS-compliant versions with three base plate options: copper, direct cooled with ribbon bonds, and direct cooled with pin fins. The modules offer an integrated NTC temperature sensor, PressFIT contact technology, and guiding elements for easy PCB and cooler assembly. Other features include high creepage and clearance distances, high power density, and low switching losses. Applications for Infineon Automotive HybridPACK IGBT Modules include EVs, HEVs, motor drives, and commercial agriculture vehicles.

750V HybridPACK™ Drive Modules

Infineon Technologies 750V HybridPACK™ Drive Modules are compact power modules optimized for hybrid and electric vehicle main inverter applications (xEV). The HybridPACK modules come with mechanical guiding elements, supporting easy assembly processes. The press-fit pins for the signal terminals avoid time-consuming selective solder processes, which provide cost savings on a system level and increase system reliability.