A10462-15

Laird Technologies
739-A10462-15
A10462-15

Mfr.:

Description:
Thermal Interface Products Tgon 805, A0 18" X 24" X 0.005"

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Availability

Stock:
0

You can still purchase this product for backorder.

On Order:
71
Factory Lead Time:
14
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
19,71 € 19,71 €
16,61 € 166,10 €
16,01 € 800,50 €
15,81 € 1.581,00 €

Product Attribute Attribute Value Select Attribute
Laird Technologies
Product Category: Thermal Interface Products
RoHS:  
Gap Fillers / Gap Pads / Sheets
Thermal Pad
Non-standard
Graphite
5 W/m-K
Pewter
- 240 C
+ 300 C
609.6 mm
457 mm
0.13 mm
650 psi
UL 94 V-0
Tgon 805
Bulk
Brand: Laird Technologies
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Product Type: Thermal Interface Products
Factory Pack Quantity: 1
Subcategory: Thermal Management
Tradename: Tgon
Unit Weight: 88 g
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Attributes selected: 0

CNHTS:
8545900000
CAHTS:
8545900000
USHTS:
8545904000
MXHTS:
8545909900
ECCN:
EAR99

Tgon™ 805 Series Thermal Interface Pads

Laird Technologies Tgon™ 805 Series Thermal Interface Pads feature a grain-oriented and plate-like structure that provides a high thermal conductivity. These interface pads include high thermal conductivity of 5W/mK on the Z-axis and 240W/mK on the X-Y-axis. The Tgon 805 series has proprietary pressure-sensitive adhesive on one side that minimizes impact on thermal performance. These interface pads offer >98% graphite, low thermal resistance, and high performance. Laird Technologies Tgon 805 pads are ideal for power conversion equipment, power supplies, large telecommunications switching hardware, and notebook computers.

Thermal Interface Solutions

Laird Technologies Thermal Interface Solutions are designed to meet the challenges of today's electronics, which are smaller but more powerful. Laird TIM products are engineered to fill in air gaps and microscopic irregularities to help deliver more efficient cooling.