A17751-08

Laird Technologies
739-A17751-08
A17751-08

Mfr.:

Description:
Thermal Interface Products Tflex HD92000 18x18

Datasheet:
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Learn more about Laird Technologies A17751-08

In Stock: 3

Stock:
3
Can Dispatch Immediately
On Order:
2
Factory Lead Time:
10
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
866,03 € 866,03 €
816,67 € 8.166,70 €

Product Attribute Attribute Value Select Attribute
Laird Technologies
Product Category: Thermal Interface Products
RoHS:  
Gap Fillers / Gap Pads / Sheets
Thermal Pad
Non-standard
Ceramic Filled Silicone
7.5 W/m-K
Gray
- 50 C
+ 125 C
457.2 mm
457.2 mm
2.03 mm
10 psi
UL 94 V-0
HD90000
Bulk
Brand: Laird Technologies
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Product Type: Thermal Interface Products
Factory Pack Quantity: 1
Subcategory: Thermal Management
Tradename: Tflex
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Attributes selected: 0

Datasheet

CNHTS:
8541900000
CAHTS:
8546900090
USHTS:
3919905060
KRHTS:
3919900000
MXHTS:
3919909900
ECCN:
EAR99

Thermal Interface Solutions

Laird Technologies Thermal Interface Solutions are designed to meet the challenges of today's electronics, which are smaller but more powerful. Laird TIM products are engineered to fill in air gaps and microscopic irregularities to help deliver more efficient cooling.

Tflex™ HD90000 Thermal Gap Filler

Laird Technologies Tflex™ HD90000 Thermal Gap Filler features a combination of 7.5W/mK thermal conductivity with superior pressure vs. deflection characteristics. This silicone-based thermal gap filler minimizes board and component stress. The ceramic-filled silicon sheets are offered in a variety of thicknesses ranging from 0.020" to 0.200". Laird Technologies Tflex™ HD90000 Thermal Gap Filler is an environmentally friendly solution that meets regulatory requirements, including RoHS and REACH.

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