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A18197-16

Name: Laird Technologies A18197-16
Brand: Laird Technologies
SKU: 774-A18197-16
Price: 18.81 EUR
Availability: InStock

Mouser No:

774-A18197-16

Mfr. No:

A18197-16

Mfr.:

Laird Technologies

Description:

Thermal Interface Products Tpcm 5400 9x9in

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In Stock: 94

Stock:: 94 Can Dispatch Immediately

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Factory Lead Time:: 6 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	18,81 €	18,81 €
	16,65 €	166,50 €
	15,27 €	763,50 €
	14,72 €	1.457,28 €
	13,56 €	7.159,68 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Laird Technologies
Product Category:	Thermal Interface Products
RoHS:
Product:	Gap Fillers / Gap Pads / Sheets
Length:	9 in
Width:	9 in
Series:	5000
Packaging:	Bulk
Brand:	Laird Technologies
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Product Type:	Thermal Interface Products
Factory Pack Quantity:	33
Subcategory:	Thermal Management
Tradename:	Tpcm

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Attributes selected: 0

USHTS:: 3919905060
KRHTS:: 3919900000
MXHTS:: 3919909900
ECCN:: EAR99

Thermal Interface Solutions

Laird Technologies Thermal Interface Solutions are designed to meet the challenges of today's electronics, which are smaller but more powerful. Laird TIM products are engineered to fill in air gaps and microscopic irregularities to help deliver more efficient cooling.

Tpcm™ 5000 High-Performance TIM

Laird Technologies Tpcm™ 5000 High-Performance Thermal Interface Material (TIM) features low thermal resistance by coupling high thermal conductivity of 5.3W/mK, minimal bond line thickness, and superior wetting of the mating surfaces. This cost-effective product utilizes a non-silicone formulation that provides a naturally tacky surface. The TIM can be applied with no pump-out occurring and offers easy reworking while delivering long-term reliability. Softening between +50°C to +70°C, the initial pad thickness can decrease to a bond line as thin as 25µm. Laird Technologies Tpcm 5000 TIM has an operating temperature range of -40°C to +125°C. Typical applications include semiconductor packaging, graphics cards, notebooks, servers, IGBTs, automotive, memory modules, and game consoles.