A18842-14

Laird Technologies
739-A18842-14
A18842-14

Mfr.:

Description:
Thermal Interface Products Tflex SF7 3.50 457x457mm

Lifecycle:
New Product:
New from this manufacturer.
Datasheet:
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Learn more about Laird Technologies A18842-14

Availability

Stock:
Non-Stocked
Factory Lead Time:
7 Weeks Estimated factory production time.
Minimum: 10   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
1.020,67 € 10.206,70 €

Product Attribute Attribute Value Select Attribute
Laird Technologies
Product Category: Thermal Interface Products
RoHS:  
Gap Fillers / Gap Pads / Sheets
Silicone-Free Gap Filler
Non-standard
Silicone
7.8 W/m-K
Gray (Dark Gray)
- 65 C
+ 150 C
457 mm
457 mm
3.5 mm
30 psi
UL 94 V-0
SF7
Bulk
Brand: Laird Technologies
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Designed for: Automotive Electronics, Datacom Systems
Product Type: Thermal Interface Products
Factory Pack Quantity: 1
Subcategory: Thermal Management
Thermal Resistance: 0.057 C/W
Tradename: Tflex
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Attributes selected: 0

Datasheet

USHTS:
3824999397
ECCN:
EAR99

Thermal Interface Solutions

Laird Technologies Thermal Interface Solutions are designed to meet the challenges of today's electronics, which are smaller but more powerful. Laird TIM products are engineered to fill in air gaps and microscopic irregularities to help deliver more efficient cooling.

Tflex SF7 Thermal Gap Fillers

Laird Technologies Tflex SF7 Thermal Gap Fillers are innovative, high-performing thermal materials with silicone-free construction. The silicone-free design supplies products with excellent deflection properties, providing minimal pressure on components during deflection. A minimum amount of pressure is required to reach the lowest possible thermal resistance. These fillers offer a 0.5mm to 4mm thickness range, 7.8W/mK thermal conductivity, and 5 x 10^13 volume resistivity. Laird Technologies Tflex SF7 Thermal Gap Fillers are ideal for datacom systems, optical modules, cameras, and automotive electronics.

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