SG-Link-200 CE Version

MicroStrain by HBK
130-SGLINK200CE
SG-Link-200 CE Version

Mfr.:

Description:
Multiple Function Sensor Modules CE Version SG-LINK-200, Wireless 3-channel analog input sensor node with onboard antenna in Ruggedized IP68 enclosure and AMPSEAL 14 pin connector. CABLE NOT INCLUDED. Operates on 2.4 GHz IEEE 802.15.4 radio. NOT CERTIFIED FOR USE IN THE U.S OR JAPAN

ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
8 Weeks Estimated factory production time.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
892,03 € 892,03 €
840,74 € 8.407,40 €

Alternative Packaging

Mfr. Part No.:
Packaging:
Availability:
Price:
889,15 €
Min:
1

Product Attribute Attribute Value Select Attribute
MicroStrain by HBK
Product Category: Multiple Function Sensor Modules
Sensor Modules
Wireless Sensor
AMPSEAL
4 V to 36 V
+ 85 C
Application: Strain, Load, Force, Pressure, Acceleration, Vibration, Displacement, Torque Sensing
Brand: MicroStrain by HBK
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Dimensions: 89.8 mm x 127 mm x 51.3 mm
Minimum Operating Temperature: - 40 C
Mounting Style: Screw Mount
Product Type: Multiple Function Sensor Modules
Factory Pack Quantity: 1
Subcategory: Sensor Modules
Part # Aliases: 6308-3300-CE
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Attributes selected: 0

USHTS:
9031808085
ECCN:
EAR99