It appears you have JavaScript disabled within your browser. Some functions on this page will not work unless you log in.

See an Error?

170071-6013

Name: Molex 170071-6013
Brand: Molex
SKU: 538-170071-6013
Price: 118.41 EUR
Availability: OutOfStock

Images are for reference only
See Product Specifications

Mouser No:

538-170071-6013

Mfr. No:

170071-6013

Mfr.:

Molex

Description:

I/O Connectors zSFP+ Stacked, 2X6 w/ Outer Light Pipe

Datasheet:

170071-6013 Datasheet

ECAD Model:

Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

More Information

Learn more about Molex 170071-6013

Availability

Stock:: Non-Stocked

An unexpected error occurred. Please try again later.
Factory Lead Time:: Request Delivery Quote

Enter Quantity:

Minimum: 24 Multiples: 24

Unit Price:

-,-- €

Ext. Price:

-,-- €

Est. Tariff:

This Product Ships FREE

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	118,41 €	2.841,84 €
	114,46 €	5.494,08 €
120	Quote

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	I/O Connectors
RoHS:
Gender:	Jack (Female)
Number of Positions:	240 Position
Pitch:	0.8 mm
Voltage Rating:	30 VAC
Contact Plating:	Gold
Mounting Style:	PCB Mount
Termination Style:	Through Hole
Mounting Angle:	Right Angle
Series:	170071
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Packaging:	Tray
Brand:	Molex
Color:	Black
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Current Rating:	500 mA
Flammability Rating:	UL 94 V-0
Product Type:	I/O Connectors
Factory Pack Quantity:	24
Subcategory:	I/O Connectors
Tradename:	ZXP
Unit Weight:	141,556 g

Products found:

To show similar products, select at least one checkbox

Select at least one checkbox above to show similar products in this category.

Attributes selected: 0

Filter Document:

Datasheet

170071-6013 Datasheet

Models

PCN

Global Change Notification (PDF)

RoHS Certificate (PDF)

TARIC:: 8536699099
CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 85366999
BRHTS:: 85366990
ECCN:: EAR99

Data/Computing Solutions

Molex Data/Computing Solutions offer seamless integration between servers, workstations, network hardware, and storage devices. Molex data and computing solutions use fast, small, efficient designs to provide superior signal integrity while meeting the high-speed and density demands of today's technology. Among solutions offered in this family are cable assemblies, connectors, flat flex cables, power connectors, multi-fiber solutions, and more. Molex Data / Computing solutions are ideal for applications ranging from the Internet of Things (IoT) to traditional networking performance.

zSFP+ 2-by-1 Stacked Integrated Cages

Molex zSFP+ 2-by-1 Stacked Integrated Cages offer superior signal integrity (SI), mechanical and electrical performance, and reduced resonance. The cages support current 10Gbps Ethernet and 16Gbps Fibre Channel applications and 25Gbps data-rate requirements. The cages feature a next-generation terminal and host footprint design and offer compact space savings and ease of processing in press-fit applications. Molex zSFP+ 2-by-1 Stacked Integrated Cages feature a low-profile metal-finger version allowing for tighter cage-to-cage pitch and a height is slightly lower than the standard version.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

zSFP+ Interconnect Solution

Molex zSFP+™ Interconnect Solution delivers unparalleled signal integrity with superior EMI protection for next-generation Ethernet and Fibre Channel applications. The innovative design provides excellent thermal management without adding unnecessary materials or costs. The zSFP+ Interconnect Solution features a stacked design that delivers maximum thermal efficiency while providing excellent signal integrity and Electromagnetic Interference (EMI) protection. Both an enhanced airflow version for applications that require light pipes and a thru-flow design which opens up the midsection to take advantage of front-to-back airflow are available. This design allows heat to be dissipated without the need for heat sink components or other complex and costly materials. The Molex zSFP+ is ideal for applications requiring 25Gbps data rates for next-generation Ethernet and Fibre Channel applications. The system provides a drop-in replacement for existing zSFP designs (re-routing of thru-flow design may be necessary if light pipes are in the midesction).