170335-3107

Name: Molex 170335-3107
Brand: Molex
SKU: 538-170335-3107
Price: 23.16 EUR
Availability: InStock

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Mouser No:

538-170335-3107

Mfr. No:

170335-3107

Mfr.:

Molex

Description:

High Speed/Modular Connectors Impact 85ohm BP 4x10 GL Sn

Datasheet:

170335-3107 Datasheet

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In Stock: 67

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	23,16 €	23,16 €
	19,69 €	196,90 €
	18,46 €	461,50 €
	17,57 €	878,50 €
	16,99 €	1.699,00 €
	16,05 €	3.210,00 €
	15,57 €	9.342,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	High Speed/Modular Connectors
RoHS:
Product:	Headers
Number of Positions:	120 Position
Number of Rows:	12 Row
Pitch:	1.9 mm
Termination Style:	Press Fit
Contact Plating:	Gold
Series:	170335
Packaging:	Tray
Brand:	Molex
Contact Material:	Tin
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	SG
Current Rating:	750 mA
Housing Colour:	Gray
Housing Material:	Thermoplastic (TP)
Maximum Operating Temperature:	+ 85 C
Minimum Operating Temperature:	- 55 C
Mounting Angle:	Vertical
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	200
Subcategory:	Backplane Connectors
Tradename:	Impact
Voltage Rating:	30 V
Unit Weight:	6,784 g

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Attributes selected: 0

Filter Document:

TARIC:: 8536693000
CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

Impact Backplane Connector System

Molex Impact Backplane System features data rates up to and beyond 25Gbps plus superior signal density of up to 30 pairs per cm. This system pushes the density envelope to meet next generation high-speed demands with one of the most versatile offerings in the market. Molex Impact Backplane System has a simple 1.90mm by 1.35mm grid that provides PCB routing flexibility.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.