170390-3000

Molex
538-170390-3000
170390-3000

Mfr.:

Description:
High Speed/Modular Connectors Impact 4x10 85Ohm GL 18mm Mezz Assy LF

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In Stock: 294

Stock:
294 Can Dispatch Immediately
Quantities greater than 294 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
21,17 € 21,17 €
19,59 € 195,90 €
18,90 € 472,50 €
18,36 € 918,00 €
17,75 € 1.775,00 €
17,30 € 3.114,00 €

Product Attribute Attribute Value Select Attribute
Molex
Product Category: High Speed/Modular Connectors
RoHS:  
Receptacles
120 Position
12 Row
1.9 mm
Press Fit
Gold
170390
Tray
Brand: Molex
Contact Material: High Performance Alloy (HPA)
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: SG
Current Rating: 750 mA
Housing Colour: Gray
Housing Material: Thermoplastic (TP)
Maximum Operating Temperature: + 85 C
Minimum Operating Temperature: - 55 C
Mounting Angle: Vertical
Product Type: High Speed / Modular Connectors
Factory Pack Quantity: 180
Subcategory: Backplane Connectors
Tradename: Impact
Voltage Rating: 30 V
Unit Weight: 9,341 g
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Attributes selected: 0

TARIC:
8536693000
CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

Impact Backplane Connector System

Molex Impact Backplane System features data rates up to and beyond 25Gbps plus superior signal density of up to 30 pairs per cm. This system pushes the density envelope to meet next generation high-speed demands with one of the most versatile offerings in the market. Molex Impact Backplane System has a simple 1.90mm by 1.35mm grid that provides PCB routing flexibility.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.