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170415-3122

Name: Molex 170415-3122
Brand: Molex
SKU: 538-170415-3122
Price: 20.6 EUR
Availability: OutOfStock

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Mouser No:

538-170415-3122

Mfr. No:

170415-3122

Mfr.:

Molex

Description:

High Speed/Modular Connectors Impact 3Pair 100 Ohm GL Mezzanine Assy

Datasheet:

170415-3122 Datasheet

ECAD Model:

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Availability

Stock:: Non-Stocked

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Minimum: 160 Multiples: 160

Unit Price:

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Ext. Price:

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Est. Tariff:

This Product Ships FREE

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	20,60 €	3.296,00 €
	19,46 €	6.227,20 €
	18,89 €	9.067,20 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	High Speed/Modular Connectors
Number of Positions:	90 Position
Number of Rows:	9 Row
Pitch:	1.9 mm
Contact Plating:	Gold
Series:	170415
Brand:	Molex
Contact Material:	Tin
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	SG
Current Rating:	750 mA
Maximum Operating Temperature:	+ 85 C
Minimum Operating Temperature:	- 55 C
Mounting Angle:	Vertical
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	160
Subcategory:	Backplane Connectors
Tradename:	Impact
Voltage Rating:	30 V
Unit Weight:	22,250 g

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Datasheet

170415-3122 Datasheet

Models

STP File (Zip)

RoHS Certificate (PDF)

TARIC:: 8536693000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
BRHTS:: 85366990
ECCN:: EAR99

Impact Backplane Connector System

Molex Impact Backplane System features data rates up to and beyond 25Gbps plus superior signal density of up to 30 pairs per cm. This system pushes the density envelope to meet next generation high-speed demands with one of the most versatile offerings in the market. Molex Impact Backplane System has a simple 1.90mm by 1.35mm grid that provides PCB routing flexibility.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.