171446-1115

Molex
538-171446-1115
171446-1115

Mfr.:

Description:
Board to Board & Mezzanine Connectors SpeedStack Vrt Plg 2.9mm Ht 60Ckt

ECAD Model:
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In Stock: 816

Stock:
816 Can Dispatch Immediately
Quantities greater than 816 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
9,81 € 9,81 €
8,34 € 83,40 €
7,82 € 195,50 €
7,45 € 372,50 €
7,14 € 714,00 €
Full Reel (Order in multiples of 500)
6,91 € 3.455,00 €
6,68 € 6.680,00 €

Product Attribute Attribute Value Select Attribute
Molex
Product Category: Board to Board & Mezzanine Connectors
RoHS:  
Plugs
60 Position
0.8 mm (0.031 in)
2 Row
Solder
Vertical
2.9 mm
800 mA
5 V
- 40 C
+ 105 C
Gold
Copper
Liquid Crystal Polymer (LCP)
171446
Reel
Cut Tape
Application: Board-to-Board
Brand: Molex
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Flammability Rating: UL 94 V-0
Mounting Style: Mounting Peg
Product Type: Board to Board & Mezzanine Connectors
Factory Pack Quantity: 500
Subcategory: Board to Board & Mezzanine Connectors
Tradename: SpeedStack
Part # Aliases: 1714461115 01714461115
Unit Weight: 638 mg
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Attributes selected: 0

TARIC:
8536693000
CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

SpeedStack Mezzanine Connector System

Molex SpeedStack Mezzanine Connector System offers a high-density, low-profile solution that delivers data rates up to 40Gbps per differential pair. With mated stack heights of 4mm to 10mm with a 0.80mm pitch, these connectors provide design flexibility for PCB space-constrained applications. The narrow housing design minimizes airflow obstructions and promotes system cooling. Molex SpeedStack Mezzanine Connector System utilizes a split-pad PCB design that allows for electrical tuning performance and provides edge card compatibility. The robust insert-molded wafer design with protected shrouded housing supports the terminal location to improve electrical balance within the signals for low-profile, high-density systems. In addition, a common grounding pin improves electrical performance and minimizes crosstalk. 

SpeedMezz Connector Family

Molex SpeedMezz Connector Family offers high densities, low profiles, data rates up to 56Gbps per differential pair. These products provide easy upgrading with common receptacle footprints. Molex SpeedMezz Connector Family delivers versatile solutions for high-speed mezzanine, rugged edge card, and lower speed applications.