208393-3003

Molex
538-208393-3003
208393-3003

Mfr.:

Description:
Headers & Wire Housings Pico-Clasp1.0 DRRAETP .76LHNat 30Ckt

ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 3200   Multiples: 3200
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
2,60 € 8.320,00 €

Product Attribute Attribute Value Select Attribute
Molex
Product Category: Headers & Wire Housings
RoHS:  
208393
Pico-Clasp
Brand: Molex
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: MY
Product Type: Headers & Wire Housings
Factory Pack Quantity: 3200
Subcategory: Headers & Wire Housings
Part # Aliases: 2083933003 02083933003
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Attributes selected: 0

TARIC:
8536693000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
BRHTS:
85366990
ECCN:
EAR99

Signal Wire-to-Wire/Wire-to-Board Connectors

Molex Signal Wire-to-Wire/Wire-to-Board Connectors and Connector Systems feature a variety of wire-to-board signal connectors that offer design flexibility. Molex Signal WTW/WTB connectors and systems are ideal for personal computers and lighting, as well as automotive and industrial applications, depending on the model.

Pico-Clasp™ Wire-to-Board Connectors

Molex Pico-Clasp™ Wire-to-Board Connectors are the smallest pitch (1.00mm) wire-to-board connectors with positive lock. Pico-Clasp 1.00mm pitch connectors come in single-row and dual-row configurations. The series offers friction and positive locks for various application needs. Pico-Clasp is designed for various connections in flat panel displays (FPD). This Molex connector system is also ideal for use in notebook PCs and other compact devices.

Miniaturization Solutions

Molex Miniaturization Solutions are ideal for a vast array of applications such as automotive, smart devices, mobile devices, and medical technology. These connectors provide space savings, high-density signals, and durability. The miniaturization of Molex connectors offers the benefit of fitting more components into smaller spaces, leading to increased functionality without the increased size or weight.