212134-0003

Molex
538-212134-0003
212134-0003

Mfr.:

Description:
Headers & Wire Housings Pico-EZMate Plus1.0 PlugAssy ETP LH 3Ckt

ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

In Stock: 46.601

Stock:
46.601
Can Dispatch Immediately
On Order:
55.989
Factory Lead Time:
23
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
0,662 € 0,66 €
0,566 € 5,66 €
0,482 € 48,20 €
0,429 € 107,25 €
0,409 € 409,00 €
0,395 € 987,50 €
Full Reel (Order in multiples of 7000)
0,356 € 2.492,00 €
0,32 € 4.480,00 €

Product Attribute Attribute Value Select Attribute
Molex
Product Category: Headers & Wire Housings
RoHS:  
Headers
Shrouded
3 Position
1 mm (0.039 in)
1 Row
SMD/SMT
Solder
Gold
212134
Pico-EZmate Plus
- 40 C
+ 105 C
Reel
Cut Tape
Brand: Molex
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: JP
Current Rating: 2.8 A
Housing Gender: Plug
Housing Material: Polyamide (PA)
Product Type: Headers & Wire Housings
Factory Pack Quantity: 7000
Subcategory: Headers & Wire Housings
Voltage Rating: 50 VAC/50 VDC
Part # Aliases: 2121340003 02121340003
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

TARIC:
8536693000
CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

Pico-EZmate Plus 1.00mm-Pitch Connector System

The Molex Pico-EZmate Plus 1.00mm-Pitch Connector System delivers high performance in a low-profile height, improved withdrawal force, and a current rating of up to 2.8A. Features include polarisation keys to prevent mismating, a low-halogen polyamide material, and thicker housing sidewalls. The connectors are ideal for automated assembly processes in tight-spaced applications within the consumer, home appliance, data centre, mobile device and medical markets.