34690-9202

Molex
538-34690-9202
34690-9202

Mfr.:

Description:
Automotive Connectors STAC64 VERT HDR 20 CKT BRN POL C TUBE

ECAD Model:
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In Stock: 97

Stock:
97 Can Dispatch Immediately
Quantities greater than 97 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
3,52 € 3,52 €
3,20 € 32,00 €
3,03 € 75,75 €
2,81 € 281,00 €
2,46 € 615,00 €
2,39 € 1.195,00 €
2,04 € 1.827,84 €
1,90 € 5.107,20 €
1,83 € 9.838,08 €

Product Attribute Attribute Value Select Attribute
Molex
Product Category: Automotive Connectors
RoHS:  
REACH - SVHC:
Headers
20 Position
2.54 mm (0.1 in)
Pin (Male)
Through Hole
Solder Pin
Tin
Brown
34690
Brand: Molex
Contact Material: Tin
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Current Rating: 10 A
Flammability Rating: UL 94 V-0
Housing Material: Thermoplastic (TP)
Maximum Operating Temperature: + 100 C
Minimum Operating Temperature: - 40 C
Mounting Angle: Straight
Number of Rows: 2 Row
Product Type: Automotive Connectors
Row Spacing: 2.54 mm
Factory Pack Quantity: 896
Subcategory: Automotive Connectors
Tradename: Stac64
Type: Shrouded
Voltage Rating: 500 V
Part # Aliases: 0346909202
Unit Weight: 7,555 g
Products found:
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Attributes selected: 0

TARIC:
8536693000
CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

Stac64 Automotive Connection System

Molex Stac64 Automotive Connection System now includes 14 circuit hybrid headers and receptacles. Molex Stac64 Automotive Connection System is a 2.54mm (.100") Pitch, stackable connection system offering a diverse range of circuit sizes. Requiring no custom tooling, the Stac64 system allows OEM and device manufacturers greater design flexibility to support both low-level signal requirements as well as power applications upwards of 30A. Molex STAC64 Automotive Connection System also allows automotive manufacturers to use header assemblies as stand-alone components, to gang multiple headers together to support a large range of signal and power needs for devices and modules.