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75710-1008

Name: Molex 75710-1008
Brand: Molex
SKU: 538-75710-1008
Price: 27.77 EUR
Availability: OutOfStock

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Mouser No:

538-75710-1008

Mfr. No:

75710-1008

Mfr.:

Molex

Description:

High Speed/Modular Connectors i-trac dcard assy 8c d assy 8col open tin

Datasheet:

75710-1008 Datasheet

ECAD Model:

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More Information

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Availability

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	27,77 €	1.666,20 €
	26,45 €	3.174,00 €
	25,79 €	7.737,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	High Speed/Modular Connectors
RoHS:
Product:	Receptacles
Number of Positions:	176 Position
Number of Rows:	11 Row
Pitch:	3.7 mm
Termination Style:	Solder Pin
Contact Plating:	Gold
Series:	75710
Packaging:	Tray
Brand:	Molex
Contact Material:	Tin
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	US
Current Rating:	1 A
Housing Material:	Thermoplastic (TP)
Maximum Operating Temperature:	+ 80 C
Minimum Operating Temperature:	- 55 C
Mounting Angle:	Right Angle
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	60
Subcategory:	Backplane Connectors
Tradename:	GbX I-Trac
Voltage Rating:	120 VAC/DC
Part # Aliases:	0757101008
Unit Weight:	21,828 g

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Datasheet

75710-1008 Datasheet

Models

RoHS Certificate (PDF)

TARIC:: 8536693000
CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

GbX I-Trac Backplane Connector System

The GbX I-Trac Vertical Header Backplane Connector System achieves superior impedance control and 12.5Gbps data rates in high-bandwidth applications. The connectors feature a unique open pin-field design, offering flexibility to assign high-speed differential pairs, low-speed signals, and power/ground contacts anywhere within the pin field.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.