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78229-2003

Name: Molex 78229-2003
Brand: Molex
SKU: 538-78229-2003
Price: 10.15 EUR
Availability: OutOfStock

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Mouser No:

538-78229-2003

Mfr. No:

78229-2003

Mfr.:

Molex

Description:

High Speed/Modular Connectors ITrac RA Pwr Hdr 7R PF w/Rt HldDwn 2Ckt

Datasheet:

78229-2003 Datasheet

ECAD Model:

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Availability

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	10,15 €	2.192,40 €
	9,47 €	4.091,04 €
	9,27 €	6.006,96 €
	8,80 €	9.504,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	High Speed/Modular Connectors
RoHS:
Number of Positions:	2 Position
Number of Rows:	2 Row
Termination Style:	Through Hole
Contact Plating:	Gold
Series:	78229
Packaging:	Tray
Brand:	Molex
Contact Material:	Tin
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	MY
Current Rating:	40 A
Maximum Operating Temperature:	+ 85 C
Minimum Operating Temperature:	- 20 C
Mounting Angle:	Right Angle
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	72
Subcategory:	Backplane Connectors
Tradename:	GbX I-Trac
Voltage Rating:	250 VDC
Part # Aliases:	0782292003
Unit Weight:	5,791 g

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Datasheet

78229-2003 Datasheet

Models

RoHS Certificate (PDF)

TARIC:: 8536693000
CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 85366999
BRHTS:: 85366990
ECCN:: EAR99

GbX I-Trac Backplane Connector System

The GbX I-Trac Vertical Header Backplane Connector System achieves superior impedance control and 12.5Gbps data rates in high-bandwidth applications. The connectors feature a unique open pin-field design, offering flexibility to assign high-speed differential pairs, low-speed signals, and power/ground contacts anywhere within the pin field.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.