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87759-1850

Name: Molex 87759-1850
Brand: Molex
SKU: 538-87759-1850
Price: 2.17 EUR
Availability: InStock

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Mouser No:

538-87759-1850

Mfr. No:

87759-1850

Mfr.:

Molex

Description:

Headers & Wire Housings 2MM HDR. 18 CKT. Vert. SMT

Datasheet:

87759-1850 Datasheet

ECAD Model:

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In Stock: 128

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Ext. Price:

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	2,17 €	2,17 €
	1,89 €	18,90 €
	1,81 €	52,49 €
	1,69 €	196,04 €
	1,52 €	396,72 €
	1,40 €	730,80 €
	1,20 €	1.218,00 €
	1,13 €	2.850,99 €
	1,06 €	5.318,02 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Headers & Wire Housings
RoHS:
Product:	Headers
Type:	Breakaway
Number of Positions:	18 Position
Pitch:	2 mm (0.079 in)
Number of Rows:	2 Row
Row Spacing:	2 mm (0.079 in)
Mounting Style:	SMD/SMT
Termination Style:	Solder
Mounting Angle:	Straight
Contact Gender:	Pin (Male)
Contact Plating:	Gold
Mating Post Length:	3.8 mm (0.15 in)
Series:	87759
Tradename:	Milli-Grid
Application:	Board-to-Board, Signal
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 125 C
Packaging:	Tube
Brand:	Molex
Contact Material:	Tin
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	ID
Current Rating:	2 A
Flammability Rating:	UL 94 V-0
Housing Material:	Thermoplastic
Product Type:	Headers & Wire Housings
Factory Pack Quantity:	1
Subcategory:	Headers & Wire Housings
Voltage Rating:	125 V
Part # Aliases:	0877591850
Unit Weight:	445 mg

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Datasheet

87759-1850 Datasheet

Models

RoHS Certificate (PDF)

TARIC:: 8536693000
CNHTS:: 8536901100
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

MolexFamMilliGrid

Miniaturization Solutions

Molex Miniaturization Solutions are ideal for a vast array of applications such as automotive, smart devices, mobile devices, and medical technology. These connectors provide space savings, high-density signals, and durability. The miniaturization of Molex connectors offers the benefit of fitting more components into smaller spaces, leading to increased functionality without the increased size or weight.