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OSDZU3EG1-2G-IFB

Name: Octavo Systems OSDZU3EG1-2G-IFB
Brand: Octavo Systems
SKU: 415-OSDZU3EG1-2G-IFB
Price: 620.09 EUR
Availability: OutOfStock

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Mouser No:

415-OSDZU3EG1-2G-IFB

Mfr. No:

OSDZU3EG1-2G-IFB

Mfr.:

Octavo Systems

Description:

System-On-Modules - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 1V8 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 85C

Lifecycle:

New At Mouser

Datasheet:

OSDZU3EG1-2G-IFB Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Octavo Systems OSDZU3EG1-2G-IFB

Availability

Stock:: 0

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On Order:: 3
Factory Lead Time:: 20

Weeks Estimated factory production time for quantities greater than shown.

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Ext. Price:

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Est. Tariff:

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	620,09 €	620,09 €
	584,44 €	7.013,28 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Octavo Systems
Product Category:	System-On-Modules - SOM
RoHS:
Series:	OSDZU3
Form Factor:	Standard BGA
Processor Type:	XCZU3EG1
Maximum RAM Capacity:	2 GB
Operating Supply Voltage:	4.5 V to 5.5 V
Interface Type:	CAN, I2C, SPI, UART, USB
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Dimensions:	20.5 mm X 40 mm
Packaging:	Tray
Brand:	Octavo Systems
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	TW
Moisture Sensitive:	Yes
Number of Cores:	6
On-Board Storage Size:	32 MB
On-Board Storage Type:	QSPI
Product Type:	System-On-Modules - SOM
Factory Pack Quantity:	6
Subcategory:	Computing

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Datasheet

OSDZU3EG1-2G-IFB Datasheet (PDF)

USHTS:: 8542310050

OSDZU3 AMD-Xilinx Zynq UltraScale+ ZU3 SiPs

Octavo Systems OSDZU3 AMD-Xilinx Zynq UltraScale+ ZU3 System-in-Packages (SiPs) are a fast, flexible way to develop a system around the AMD Xilinx^® Zynq^® UltraScale+™ MPSoC. These SiPs allow users to harness the performance of the ZU3 MPSoC while removing the complexities without sacrificing flexibility. The OSZU3 SiPs integrate the AMD-Xilinx ZU3 Zynq UltraScale+ MPSoC, with 2GB (16GB) LPDDR4, power management, and other required components into a single BGA package. This integration reduces design effort by months, allowing users to get to market faster or spend time adding more features to products.