CL03C100JA3GNNC

Samsung Electro-Mechanics
187-CL03C100JA3GNNC
CL03C100JA3GNNC

Mfr.:

Description:
Multilayer Ceramic Capacitors MLCC - SMD/SMT 10pF+/-5% 25V C0G 06 0201

Datasheet:
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Learn more about Samsung Electro-Mechanics CL03C100JA3GNNC

In Stock: 22.159

Stock:
22.159 Can Dispatch Immediately
Factory Lead Time:
20 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 10000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
0,086 € 0,09 €
0,03 € 0,30 €
0,026 € 2,60 €
0,019 € 9,50 €
0,017 € 17,00 €
0,015 € 37,50 €
0,014 € 70,00 €
Full Reel (Order in multiples of 10000)
0,01 € 100,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Samsung Electro-Mechanics
Product Category: Multilayer Ceramic Capacitors MLCC - SMD/SMT
RoHS:  
10 pF
25 VDC
C0G (NP0)
5 %
0201
0603
SMD/SMT
Standard
- 55 C
+ 125 C
0.6 mm (0.024 in)
0.3 mm (0.012 in)
0.33 mm (0.013 in)
General Type MLCCs
CL-Standard
Reel
Cut Tape
MouseReel
Brand: Samsung Electro-Mechanics
Class: Class 1
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: PH
Package/Case: 0201 (0603 metric)
Product Type: Ceramic Capacitors
Factory Pack Quantity: 10000
Subcategory: Capacitors
Type: Multilayer Ceramic Capacitor
Part # Aliases: CL03C100JA3GNN
Unit Weight: 0,330 mg
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Attributes selected: 0

Datasheet

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TARIC:
8532240000
CNHTS:
8532241000
USHTS:
8532240020
JPHTS:
853224000
BRHTS:
85322410
ECCN:
EAR99

CL MLCC Standard Normal Capacitors

Samsung Electro-Mechanics CL MLCC Standard Normal Capacitors are broadly available chip-type capacitor that temporarily charges and remove noise in electric circuits. These standard normal capacitors offer various sizes and a wide range of capacities. The CL Multilayer Ceramic Capacitors (MLCC) provide a structural capacity to mount chips on a PCB at high speed. Typical applications include automotive, smartphones, PC, HDD/SSD boards, tablets, displays, game machines, and DC-DC converters.

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