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SEAM-30-09.0-S-08-2-A-K-TR

Name: Samtec SEAM-30-09.0-S-08-2-A-K-TR
Brand: Samtec
SKU: 200-SEAM3009.0S082AK
Price: 27.31 EUR
Availability: InStock

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Mouser No:

200-SEAM3009.0S082AK

Mfr. No:

SEAM-30-09.0-S-08-2-A-K-TR

Mfr.:

Samtec

Description:

Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal

Datasheet:

SEAM-30-09.0-S-08-2-A-K-TR Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Samtec SEAM-30-09.0-S-08-2-A-K-TR

Availability

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561 Can Dispatch in 10 Days

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	27,31 €	27,31 €
	26,11 €	261,10 €
	25,13 €	628,25 €
	23,29 €	1.164,50 €
	21,49 €	2.149,00 €
Full Reel (Order in multiples of 75)
	23,29 €	1.746,75 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	Board to Board & Mezzanine Connectors
RoHS:
Product:	Headers
Number of Positions:	240 Position
Pitch:	1.27 mm (0.05 in)
Number of Rows:	8 Row
Termination Style:	Solder
Mounting Angle:	Vertical
Stack Height:	14 mm, 15 mm, 15.5 mm, 16.5 mm
Current Rating:	2.7 A
Voltage Rating:	240 VAC
Maximum Data Rate:	56 Gbps
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 125 C
Contact Plating:	Gold
Contact Material:	Copper Alloy
Housing Material:	Liquid Crystal Polymer (LCP)
Series:	SEAM
Packaging:	Reel
Packaging:	Cut Tape
Application:	Power, Signal
Brand:	Samtec
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	US
Data Rate:	56 Gbps
Mounting Style:	SMD/SMT
Product Type:	Board to Board & Mezzanine Connectors
Factory Pack Quantity:	75
Subcategory:	Board to Board & Mezzanine Connectors
Tradename:	SEARAY
Unit Weight:	1,412 g

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Datasheet

SEAM-30-09.0-S-08-2-A-K-TR Datasheet (PDF)

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Models

Specification Sheets

Technical Resources

Test Report (PDF)

TARIC:: 8536693000
CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

SEARAY™ SEAM Series Connectors

Samtec SEARAY™ SEAM Series Connectors offer 56 Gbps PAM4 performance. The connectors feature a .050" (1.27mm) pitch grid for maximum routing flexibility and up to 500 single-ended I/Os. Other features include the rugged Edge Rate® contacts, low insertion/withdrawal forces, and the availability in 7mm - 17.5mm stack heights.

High-Density Arrays

Samtec High-Density Arrays include board-to-board mezzanine connectors and rectangular cable assemblies. These components are offered in a range of mounting angles, including horizontal, right, straight, and vertical with a wide selection of termination styles. The number of positions ranges from 100 to 560 while the number of rows ranges from 4 to 14. Samtec High-Density Arrays are available in several pitches, including 0.635mm, 0.8mm, and 1.27mm.

5G Solutions

Samtec 5G Solutions support the ultra-high frequencies and high data rates that emerging 5G technologies demand. As this 5G network quickly gains momentum, new systems, devices, and equipment are needed for technologies such as mmWave, Massive MIMO, beamforming, and full-duplex (FDX). Samtec 5G Solutions feature high-performance products for four applications: Test and Development Systems, Remote Radio and Active Antennas, Network Equipment, and Automotive and Transportation.

Flexible Stacking Connectors

Samtec Flex Stacking Board Connectors feature a large variety of board-to-board connectors with design flexibility. These Samtec board-to-board connector systems are available in a variety of pitches, densities, stack heights, orientations, and other standard or modified options, making it easy to find the right connector for any application. Flex-Stack options include one-piece, low profile pass-through, elevated, hermaphroditic, shrouded, coplanar, parallel, and perpendicular. Post heights are adjustable in increments of 0.005” (0.13mm).

5G Automotive & Transportation Solutions

Samtec 5G Automotive and Transportation Connectivity meets the needs of the growing 5G network market. As implementation of the 5G network quickly gains momentum, high-performance devices, systems, and test and measurement equipment are needed to support the ultra-high frequencies and high data rates that technologies like mmWave, Massive MIMO, beamforming, and full duplex demand. Samtec offers high-performance interconnects and high-level technical expertise to support these requirements, including an expanding portfolio of solutions ideal for Automotive applications.