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MGM260PD32VNN2

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Mouser No:

634-MGM260PD32VNN2

Mfr. No:

MGM260PD32VNN2

Mfr.:

Silicon Labs

Description:

Multiprotocol Modules 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module

Lifecycle:

New At Mouser

Datasheet:

MGM260PD32VNN2 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Silicon Labs MGM260PD32VNN2

Delivery Restriction:

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Silicon Labs
Product Category:	Multiprotocol Modules
Delivery Restriction:	Mouser does not presently sell this product in your region.
RoHS:
Series:	MGM260P
Frequency:	2.4 GHz
Output Power:	20 dBm
Interface Type:	ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART
Supply Voltage - Min:	1.8 V
Supply Voltage - Max:	3.8 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 125 C
Dimensions:	12.9 mm x 15 mm
Protocol - Bluetooth, BLE - 802.15.1:	Bluetooth, BLE
Protocol - ANT, Thread, Zigbee - 802.15.4:	Thread, Zigbee - 802.15.4
Packaging:	Cut Tape
Antenna:	PCB Trace
Brand:	Silicon Labs
Core:	32-bit ARM Cortex M33
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Data Rate:	2 Mb/s
Memory Size:	3.2 MB Flash, 512 kB RAM
Modulation Technique:	DSSS, GFSK, O-QPSK
Moisture Sensitive:	Yes
Mounting Style:	SMD/SMT
Operating Supply Voltage:	1.8 V to 3.8 V
Product:	Multiprotocol Wireless Module
Product Type:	Multiprotocol Modules
Protocol:	Bluetooth v5.4
Sensitivity:	- 105.6 dBm
Factory Pack Quantity:	100
Subcategory:	Wireless & RF Modules
Supply Current Receiving:	6.4 mA
Supply Current Transmitting:	162 mA

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Attributes selected: 0

Filter Document:

TARIC:: 8517620000
USHTS:: 8517620090
JPHTS:: 851762090
ECCN:: 5A992.C

xGM260P Wireless Modules

Silicon Labs xGM260P Wireless Modules are 2.4GHz frequency devices that deliver excellent RF performance. The MGM260P modules are based on the EFR32MG26 System-on-Chips (SoCs) and support Bluetooth^®, Zigbee^®, Thread, and Matter protocols. These MGM260P modules feature Secure Vault® technology and support various advanced debugging and development tools. The BGM260P modules are based on the EFR32BG26 SoCs and support Bluetooth Low Energy (BLE) and Bluetooth mesh. These xGM260P wireless modules are ideal for use in light bulbs and designs that require extra PCB layout flexibility.