BMC-Q2CY0050H

TE Connectivity / Sigma Inductors
279-BMC-Q2CY0050H
BMC-Q2CY0050H

Mfr.:

Description:
Ferrite Beads BMC-Q 1204 50R 25% Tol. High Current

Lifecycle:
New Product:
New from this manufacturer.
Datasheet:
ECAD Model:
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Learn more about TE Connectivity / Sigma Inductors BMC-Q2CY0050H

In Stock: 8.000

Stock:
8.000 Can Dispatch Immediately
Factory Lead Time:
19 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
0,473 € 0,47 €
0,332 € 3,32 €
0,287 € 7,18 €
0,256 € 12,80 €
0,228 € 22,80 €
0,194 € 48,50 €
0,169 € 84,50 €
0,147 € 147,00 €
Full Reel (Order in multiples of 4000)
0,137 € 548,00 €

Product Attribute Attribute Value Select Attribute
TE Connectivity
Product Category: Ferrite Beads
RoHS:  
Ferrite Chip Beads
SMD/SMT
1204 (3216 metric)
50 Ohms
3 A
25 %
70 mOhms
- 40 C
+ 125 C
3.2 mm
1.6 mm
0.9 mm
Reel
Cut Tape
Brand: TE Connectivity / Sigma Inductors
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Operating Temperature Range: - 40 C to + 125 C
Product Type: Ferrite Beads
Factory Pack Quantity: 4000
Subcategory: Ferrites
Test Frequency: 100 MHz
Type: Multilayer High Current
Part # Aliases: 1-2176745-2
Products found:
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Attributes selected: 0

Datasheet

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TARIC:
8504500090
CAHTS:
8504500000
USHTS:
8548000000
JPHTS:
850450000
MXHTS:
8504509199
BRHTS:
85045000
ECCN:
EAR99

BMC-Q Automotive Multilayer Chip Beads

TE Connectivity's (TE) BMC-Q Automotive Multilayer Chip Beads are AEC-Q200 qualified and are available in 0402, 0603, 0805 and 1204 packaging sizes. These chip beads are designed with monolithic inorganic material construction, giving them high and ultra-high current capability. BMC-Q series chip beads prevent undesirable noise, producing optimum signal transmission. The chip beads also shield against undesirable power loss for DC voltage applications. TE BMC-Q Automotive Multilayer Chip Beads are suitable for automotive multimedia systems, wireless connection systems, body comfort systems, and automotive low-power systems.

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