3-1871057-0

TE Connectivity
571-3-1871057-0
3-1871057-0

Mfr.:

Description:
Headers & Wire Housings REC HSG 40P X YELLOW

ECAD Model:
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In Stock: 1.504

Stock:
1.504 Can Dispatch Immediately
Factory Lead Time:
38 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
1,88 € 1,88 €
1,65 € 16,50 €
1,52 € 304,00 €
1,27 € 762,00 €
1,06 € 1.060,00 €
0,989 € 2.571,40 €
0,946 € 4.730,00 €

Product Attribute Attribute Value Select Attribute
TE Connectivity
Product Category: Headers & Wire Housings
RoHS:  
Wire Housings
Receptacle Housing
40 Position
2 mm (0.079 in)
2 Row
Cable Mount / Free Hanging
Crimp
Socket (Female)
D-1000
DYNAMIC SERIES
Wire-to-Board
- 55 C
+ 105 C
Bulk
Brand: TE Connectivity
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Product Type: Headers & Wire Housings
Factory Pack Quantity: 200
Subcategory: Headers & Wire Housings
Unit Weight: 3,437 g
Products found:
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Attributes selected: 0

TARIC:
8538909999
CNHTS:
8538900000
CAHTS:
8538909090
USHTS:
8538906000
JPHTS:
853890000
BRHTS:
85389090
ECCN:
EAR99

Dynamic Series Ruggedized Connectors

TE Connectivity's Dynamic Series Ruggedized Connectors are designed for use in control systems and in a wide range of applications requiring high-density, signal, and power. The series features a ruggedized, industrialized package that provides connector solutions ranging from signal-level circuitry to power circuit connectivity. The portfolio includes wire-to-board, wire-to-panel, and wire-to-wire connectors with a diverse range of housings. Standard crimp and spring clamp variations of parts are available. The standardized contacts limit the amount of application tooling required. A centralized wiring system saves time and costs by offering a modular capability that allows for expansion as needed. Typical applications for TE Dynamic Series Ruggedized Connectors include industrial control, Human Machine Interface (HMI), data communication, robotics, power distribution, and more.