TLVM13630RDHR

Texas Instruments
595-TLVM13630RDHR
TLVM13630RDHR

Mfr.:

Description:
Power Management Modules High-Density 3V to 3 6V Input 1V to 6V

ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

Availability

Stock:
0

You can still purchase this product for backorder.

On Order:
5.409
Factory Lead Time:
12
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 3000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
3,58 € 3,58 €
3,21 € 32,10 €
2,62 € 262,00 €
2,49 € 622,50 €
2,24 € 1.120,00 €
1,88 € 1.880,00 €
Full Reel (Order in multiples of 3000)
1,79 € 5.370,00 €
1,74 € 10.440,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Product Attribute Attribute Value Select Attribute
Texas Instruments
Product Category: Power Management Modules
RoHS:  
Power Modules
36 V
1 V to 6 V
3 A
2.2 MHz
Brand: Texas Instruments
Country of Assembly: CN
Country of Diffusion: US
Country of Origin: CN
Dimensions: 4 mm x 6 mm x 1.9 mm
Input Voltage - Min: 3 V
Load Regulation: Yes,Regulated
Maximum Operating Temperature: + 125 C
Minimum Operating Temperature: - 40 C
Moisture Sensitive: Yes
Packaging: Reel
Packaging: Cut Tape
Packaging: MouseReel
Product Type: Power Management Modules
Series: TLVM13630
Factory Pack Quantity: 3000
Subcategory: Embedded Solutions
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

This functionality requires JavaScript to be enabled.

CNHTS:
8542399000
CAHTS:
8542390000
USHTS:
8542390090
MXHTS:
8542399999
ECCN:
EAR99

TLVM13630 Power Modules

Texas Instruments TLVM13630 Power Modules are highly integrated 36V, 3A DC/DC synchronous buck power modules that combine power MOSFETs, a shielded inductor, and passives in an Enhanced HotRod™ QFN package. The module provides pins for VIN and VOUT at the package's corners for optimized input and output capacitor layout placement. Four larger thermal pads underneath the module facilitate a simple layout and easy manufacturing handling.