Samtec SEAMP Series Board to Board & Mezzanine Connectors

Results: 112
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Number of Positions Pitch Number of Rows Termination Style Mounting Angle Current Rating Voltage Rating Minimum Operating Temperature Maximum Operating Temperature Contact Plating Contact Material Housing Material Series Packaging
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 66In Stock
Min.: 1
Mult.: 1

Headers 240 Position 1.27 mm (0.05 in) 6 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tray
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 28In Stock
Min.: 1
Mult.: 1

Headers 160 Position 1.27 mm (0.05 in) 8 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tube
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 23In Stock
Min.: 1
Mult.: 1

Headers 160 Position 1.27 mm (0.05 in) 8 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tube
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 60In Stock
Min.: 1
Mult.: 1

Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tray
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 4In Stock
Min.: 1
Mult.: 1

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tray
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 31In Stock
Min.: 1
Mult.: 1

Headers 240 Position 1.27 mm (0.05 in) 6 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tray
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 5In Stock
Min.: 1
Mult.: 1

Headers 240 Position 1.27 mm (0.05 in) 6 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tube
Samtec Board to Board & Mezzanine Connectors 1.27MM SEARAY HS HD ARRAY 26In Stock
Min.: 1
Mult.: 1

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tray
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 4In Stock
Min.: 1
Mult.: 1

Headers 300 Position 1.27 mm (0.05 in) 6 Row Solder Pin Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tube
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 32In Stock
Min.: 1
Mult.: 1

Headers 300 Position 1.27 mm (0.05 in) 6 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tray
Samtec Board to Board & Mezzanine Connectors 1.27MM SEARAY HS HD ARRAY TERM 7In Stock
Min.: 1
Mult.: 1

Headers 300 Position 1.27 mm (0.05 in) 6 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tube
Samtec Board to Board & Mezzanine Connectors 1.27MM SEARAY HS HD ARRAY TERM 1In Stock
Min.: 1
Mult.: 1

Headers 200 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tube
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 1In Stock
Min.: 1
Mult.: 1

Headers 500 Position 1.27 mm (0.05 in) 10 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tube
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 19In Stock
Min.: 1
Mult.: 1

Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tray
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 64Factory Stock Available
Min.: 1
Mult.: 1

Headers 120 Position 1.27 mm (0.05 in) 6 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tray
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Non-Stocked Lead-Time 8 Weeks
Min.: 125
Mult.: 125
: 125

Headers 40 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Non-Stocked Lead-Time 8 Weeks
Min.: 200
Mult.: 200
: 200

Headers 80 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Non-Stocked Lead-Time 2 Weeks
Min.: 125
Mult.: 125
: 125

Headers 120 Position 1.27 mm (0.05 in) 6 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Non-Stocked Lead-Time 2 Weeks
Min.: 125
Mult.: 125
: 125

Headers 160 Position 1.27 mm (0.05 in) 8 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Non-Stocked Lead-Time 8 Weeks
Min.: 125
Mult.: 125
: 125

Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Non-Stocked Lead-Time 2 Weeks
Min.: 125
Mult.: 125
: 125

Headers 180 Position 1.27 mm (0.05 in) 6 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Non-Stocked Lead-Time 8 Weeks
Min.: 125
Mult.: 125
: 125

Headers 240 Position 1.27 mm (0.05 in) 8 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Non-Stocked Lead-Time 2 Weeks
Min.: 100
Mult.: 100
: 100

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Non-Stocked Lead-Time 8 Weeks
Min.: 125
Mult.: 125
: 125

Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Non-Stocked Lead-Time 8 Weeks
Min.: 125
Mult.: 125
: 125

Headers 240 Position 1.27 mm (0.05 in) 8 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel