APF6 Series Board to Board & Mezzanine Connectors

Results: 84
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Number of Positions Pitch Number of Rows Termination Style Mounting Angle Current Rating Voltage Rating Maximum Data Rate Minimum Operating Temperature Maximum Operating Temperature Contact Plating Contact Material Housing Material Series Packaging
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate HP High-Performance Array Socket Non-Stocked Lead-Time 6 Weeks
Min.: 500
Mult.: 500
: 500
APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket Non-Stocked Lead-Time 4 Weeks
Min.: 500
Mult.: 500
: 500
Sockets 100 Position 0.635 mm (0.025 in) 4 Row Solder Balls Vertical 112 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket Non-Stocked Lead-Time 3 Weeks
Min.: 500
Mult.: 500
: 500
Sockets 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate HP High-Performance Array Socket Non-Stocked Lead-Time 3 Weeks
Min.: 500
Mult.: 500
: 500
Sockets 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Vertical 112 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate HP High-Performance Array Socket Non-Stocked Lead-Time 3 Weeks
Min.: 500
Mult.: 500
: 500
Sockets 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Vertical 112 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket Non-Stocked Lead-Time 4 Weeks
Min.: 500
Mult.: 500
: 500
Sockets 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Vertical 112 Gbps - 40 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket Non-Stocked Lead-Time 1 Week
Min.: 500
Mult.: 500
: 500
Sockets 400 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate(R) HP High-Performance Array Socket Non-Stocked Lead-Time 5 Weeks
Min.: 500
Mult.: 500
: 500

Sockets 160 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 1.34 A 155 VAC 56 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) APF6 Reel
Samtec Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate HP High-Performance Array Socket Non-Stocked Lead-Time 6 Weeks

Socket Array 25 Position 0.635 mm (0.025 in) 6 Row Solder Vertical Gold Copper Liquid Crystal Polymer (LCP) APF6 Reel