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TGP40000SF-0.125-01-0606-NA

Name: Bergquist Company TGP40000SF-0.125-01-0606-NA
Brand: Bergquist Company
SKU: 951-TGP400SF.1250166
Price: 351.06 EUR
Availability: InStock

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Mouser No:

951-TGP400SF.1250166

Mfr. No:

TGP40000SF-0.125-01-0606-NA

Mfr.:

Bergquist Company

Description:

Thermal Interface Products GAP PAD, Sil-Free, 40W/m-K, 6 x 6" Sheet, Tacky Pad, 0.125" Thickness, Thermexit

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

TGP40000SF-0.125-01-0606-NA Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Bergquist Company TGP40000SF-0.125-01-0606-NA

In Stock: 3

Stock:: 3 Can Dispatch Immediately

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Factory Lead Time:: 7 Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

Unit Price:

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Ext. Price:

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Est. Tariff:

This Product Ships FREE

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	351,06 €	351,06 €
	323,46 €	3.234,60 €
	300,36 €	7.509,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Bergquist Company
Product Category:	Thermal Interface Products
RoHS:
Product:	Gap Fillers / Gap Pads / Sheets
Type:	Thermal Pad
Package/Case:	Non-standard
Material:	Silicone-Free Polymer
Thermal Conductivity:	40 W/m-K
Color:	Black
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 150 C
Length:	152.4 mm
Width:	152.4 mm
Thickness:	3.175 mm
Series:	TGP 40000SF
Brand:	Bergquist Company
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	US
Designed for:	Silcone Sensitive Applications, Telecommunications, Optical, ASICs/DSPs, Storage, Automotive, Power Converters, Aerospace, LEDs and Lasers
Height:	4 in
Product Type:	Thermal Interface Products
Size:	6 in x 6 in
Factory Pack Quantity:	5
Subcategory:	Thermal Management
Tradename:	GAP PAD / Thermexit
Part # Aliases:	TGP40000SF-0.125-01-0606 2987848
Unit Weight:	125 g

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Datasheet

TGP40000SF-0.125-01-0606-NA Datasheet (PDF)

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USHTS:: 3921905050
ECCN:: EAR99

TGP 40000SF 40W/m-K Silicone Free GAP PAD®

Bergquist TGP 40000SF 40W/m-K Silicone Free GAP PAD® features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity. The GAP PAD thermal interface products, formerly known as Thermexit, are uniquely designed for thermal management applications requiring silicone-free solutions. Due to its oriented filler technology, the TGP 40000SF series delivers excellent thermal performance at 56psi peak pressure. The GAP PAD products offer a higher thermal conductivity rating than previous thermal interface materials (TIMs) with easier handling, lower density, and a more lightweight sheet thickness. The TGP 40000SF 40W/m-K GAP PAD polymer construction allows low liquid migration without silicone outgassing or mobile polymer bleed, and these models include tack on one side. Bergquist TGP 40000SF 40W/m-K Silicone Free GAP PAD products are ideal for various applications, including telecommunications, automotive modules, and aerospace modules.